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2017-10-30

Besi Datacon 8810FC Flipchip 8800 Chameo Die Bonder

Besi Datacon 8810FC Flipchip Die Bonder

Model : 8810FC (8800 Chameo Series)
Serial No: 950 8810 1609

Tested to be working condition before pulling out from factory.

Along with manuals & Software CD

Thanks
Semimax Korea Corporation
sales@semimax.com

































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